- AMD Ryzen™ V1605B/ V1807B CPU
- 1x DDR4 2,400 / 3,200 SDRAM, up to 32GB
- AMD Radeon™ RX Vega
- 4x Gigabit PoE+ ports
- Operating temperature: -25° ~ 70 °C
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Product: POC-500 Series
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Product: POC-500 Series
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Description
POC-500 series – Strong computing power and robust design
The POC-500 series is equipped with an AMD Ryzen™ Embedded V1000 processor with 4 processor cores/8 threads. The built-in GPU delivers a performance of 3.6 TFLOPS in the FP16 benchmark test. A special feature of the POC-500 series is that an M.2 2280 NVMe SSD (PCIe Gen3 x2) is integrated into this compact device.
The series can be mounted on a DIN rail and has numerous I/O connections accessible from the front. Despite its compact design of 63 x 176 x 116 mm, the series also offers 4 PoE+ ports, 4 USB 3.0 ports and 4 COM ports. The data ports are also equipped with a screw mechanism that prevents the cables from being pulled out. There is a choice of two CPUs within the systems: the V1807B variant (45 W) is designed for the highest computing power requirements and the V1605B variant (15 W) is specially designed for fanless operation in harsh operating environments.
The series consists of ultra-compact embedded controllers with a special I/O design that is particularly robust and offers significantly more CPU or GPU power and is therefore recommended for numerous applications.
Supported MezIO™ modules
The MezIO™ module processes both computer signals (data bus) and control signals via a high-speed connection. It also has a power supply. This module turns the models into application-specific systems with application-oriented I/O components such as RS-232/422/485, isolated DIO and ignition control.
Specifications
POC-515 | POC-545 | |
---|---|---|
SYSTEM | ||
CPU | AMD Ryzen™ embedded V1605B CPU (4C/ 8T, 2M Cache, 2.0/ 3.6 GHz,12W – 25W TDP) |
AMD Ryzen™ embedded V1807B CPU (4C/ 8T, 2M Cache, 3.35/ 3.8 GHz,35W – 54W TDP) |
Graphics | Vega GPU with 8 compute units | Vega GPU with 11 compute units |
RAM | Up to 32GB DDR4 2,400 SDRAM by one SODIMM socket |
Up to 32GB DDR4 3,200 SDRAM by one SODIMM socket |
Storage | 1x M.2 2280 M key NVMe socket (PCIe Gen3 x2) for NVMe SSD installation | |
TPM | Supports TPM 2.0 | |
Expansion | 1x full-size mini PCI Express socket with internal SIM socket 1x MezIO® expansion interface for Neousys MezIO® modules |
|
INTERFACE | ||
Ethernet | 4x Gigabit Ethernet ports with screw-lock IEEE 802.3at PoE+ on port #1~ 4 100 W total power budget |
|
USB | 4x USB 3.1 Gen1 ports with screw-lock | |
COM | COM 1: 1x software-programmable RS-232/ 422/ 485 port COM2/3/4: 3x 3-wire RS-232 ports or COM 2: 1x RS-422/ 485 port |
|
Video | 1x VGA connector, supporting 1,920 x 1,200 resolution 1x DisplayPort connector, supporting 4,096 x 2,160 resolution |
|
Audio | 1x 3.5mm jack for mic-in and speaker-out | |
ENVIRONMENTAL | ||
Cooling | Fanless | External-accessible 80mm x 80mm fan for system heat dissipation |
Power Supply | 1x 3-pin pluggable terminal block for 8 ~ 35V DC input | |
Remote Control & LED | 1×3-pin pluggable terminal block for remote control and PWR LED output | |
Operating Temperature | -25° ~ 70°C */** | |
Storage Temperature | -40° ~85°C | |
Vibration/Shock Resistance | Vibration: Operating, MIL-STD-810G, Method 514.6, Category 4 Shock: Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II |
|
Humidity | 10 ~ 90% , non-condensing | |
Dimensions | 64(W) x 116 (D) x 176 (H) mm | 81 (W) x 118 (D) x 176 (H) mm |
Weight | 1.2kg | 1.4kg |
Mounting | DIN-rail mount (standard) or wall-mount (optional) | |
Certifications | Safety: EN62368-1 EMC: CE/ FCC Class A, according to EN 55032 & EN 55024 |
** For POC-545, operating temperature is up to 70°C only if external-accessible fan is installed.
Ordering Information
POC-515 | POC-516 | POC-545 | POC-546 | |
---|---|---|---|---|
CPU | AMD Ryzen™ V1605B CPU ( 4C/ 8T, 2M Cache, 2.0/ 3.6 GHz, 12W – 25W TDP | AMD Ryzen™ V1605B CPU ( 4C/ 8T, 2M Cache, 2.0/ 3.6 GHz, 12W – 25W TDP | AMD Ryzen™ V1807B CPU ( 4C/ 8T, 2M Cache, 3.35/ 3.8 GHz, 35W – 54W TDP) | AMD Ryzen™ V1807B CPU ( 4C/ 8T, 2M Cache, 3.35/ 3.8 GHz, 35W – 54W TDP) |
Features | 4x PoE+ Ports 4x USB 3.1 MezIO™ Interface |
4x PoE+ Ports 4x USB 3.1 MezIO™ R12 |
24x PoE+ Ports 4x USB 3.1 MezIO™ Interface |
4x PoE+ Ports 4x USB 3.1 MezIO™ R12 |
Dimensions and Weight | 64 x 116 x 176 mm 1.2kg |
64 x 116 x 176 mm 1.2kg |
82 x 118 x 176 mm 1.4kg |
82 x 118 x 176 mm 1.4kg |
Documents
Datasheet |
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