- Scalable and wireless system-on-modules
- NXP i.MX 93 single/dual-core application processor
- Low-profile Digi SMTplus™
- Dual-band Wi-Fi and Bluetooth 5.3®
- Integration of cellular modem and Digi XBee®
Description
Digi ConnectCore® 93 series – Embedded system-on-module based on the NXP i.MX 93 processor with AI/ML NPU for industrial applications
The Digi ConnectCore® 93, based on the NXP® i.MX 93 application processor, defines a new era for embedded systems. This System-on-Module (SOM) provides a powerful platform for medical, industrial, energy and transportation applications, including IoT, automation, HMI, device monitoring, audio/voice, edge computing and machine learning.
Powerful processor and AI support
With up to two low-power Arm® Cortex®-A55 cores, one Cortex-M33 core and an integrated AI/ML Arm Ethos U65 NPU, the Digi ConnectCore® 93 offers outstanding performance and energy efficiency. The NXP PMIC maximizes energy efficiency and enables a long lifetime of more than 10 years for embedded devices.
The Digi ConnectCore® 93 SOM features Wi-Fi 6 and Bluetooth 5.3 for reliable and fast wireless connectivity. The Digi SMTplus surface mount form factor ensures easy design integration, efficiency and reliability.
Secure and reliable
Embedded device security is the focus of the Digi ConnectCore® 93, which offers integrated security with Digi TrustFence®, a comprehensive device security framework. This simplifies the process of securing connected devices.
Digi ConnectCore Cloud Services, Digi ConnectCore Security Services and Expert Support offer comprehensive options for development, deployment and maintenance. The Digi Embedded Yocto® Linux distribution provides a fully tested, validated and maintained Linux software platform.
With over twenty years of experience in embedded SOMs and millions of products networked worldwide, Digi is a trusted provider of embedded and IoT solutions. Digi Wireless Design Services (WDS) provides additional wireless integration support, certification assistance and custom design and build services to get your products to market faster and smarter.
Specifications
| Digi ConnectCore® 93 | |
|---|---|
| FEATURES | |
| Application processor | NXP® i.MX 93
|
| Memory | Up to 32 GB flash (eMMC), up to 2 GB LPDDR4 / LPDDR4X (16-bit) |
| NPU | AI/ML Arm® Ethos U65 micro neural processor |
| PMIC | NXP PCA9451 |
| Graphics / Display | 2D Engine:
1x 1080p 60 MIPI DSI (4-lane, 1.5 Gbps/lane) with PHY |
| Camera | 1x 1080p 60 MIPI-CSI (2-lane, 1.5 Gbps/lane) with PHY 8-bit parallel YUV/RGB |
| Security | Digi TrustFence®: secure boot, filesystem encryption, tamper detection, secure JTAG, secure console, secure build environments, secure firmware updates; EdgeLock secure enclave: crypto, tamper detection, secure clock, secure boot, eFuse key storage, random number; Arm TrustZone (Cortex-A and Cortex-M) |
| Peripherals / Interfaces | 2x USB 2.0 OTG controllers with integrated PHY interfaces 1x Ultra Secure Digital Host Controller (uSDHC) interfaces 8x Low Power Universal Asynchronous Receiver / Transmitter (LPUART) modules 8x Low Power I2C modules, 2x I3C 8x Low Power SPI (LPSPI) modules 2x FlexCAN with flexible data-rate (FD) support 4x pulse-width modulator (PWM) with 16-bit counter 1x 12-bit ADC module with accurate internal voltage reference, up to 4 channels 3x Synchronous Audio Interface (SAI) modules (up to 4 lanes) supporting I2S, AC97, TDM, codec/DSP and DSD interfaces 1x S/PDIF input and output, including a raw capture input mode 8-channel Pulse Density Modulation (PDM) input Up to 112 GPIOs |
| Ethernet | 2x 10/100/1000M Ethernet with EEE, AVB and IEEE 1588 (1x TSN) |
| Wi-Fi | Wi-Fi 6 802.11ax dual-band 1×1 wireless |
| Bluetooth® | Bluetooth® 5.3 |
| 802.15.4 | 802.15.4 (optional) |
| On-module microcontroller assist | Digi Microcontroller Assist™ for advanced power management, security, peripheral support and system reliability (optional)
|
| Operating temperature | Industrial: −40 °C to 85 °C (−40 °F to 185 °F); depending on use case and enclosure/system design |
| Storage temperature | −50 °C to 125 °C (−58 °F to 257 °F) |
| Relative humidity | 5% to 90% (non-condensing) |
| Radio approvals[1] | US, Canada, EU, Japan, Australia/New Zealand, Brazil, Mexico |
| Emissions / Immunity / Safety [1] | FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1) |
| Design verification [1] | Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 Vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT |
| Mechanical dimensions | 118 castellated vias, LGA-474, 1.27 mm pitch, 40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in) |
| Product warranty | 3-year |
[1] Visit product certifications for latest updates.
Order information
| Order information | Digi ConnectCore® 93 series |
|---|---|
| DEVELOPMENT KIT | |
| CC-WMX93-KIT | Digi ConnectCore 93 Development Kit
|
| MODULES | |
| CC-WMX-YC7D-KN | Digi ConnectCore 93 System-On-Module — dual-core, NPU, wireless
|
| CC-MX-YC7D-ZN | Digi ConnectCore 93 System-On-Module — dual-core, NPU, Ethernet
|
| CC-WMX-ZC6D-L1 | Digi ConnectCore 93 System-On-Module — single-core, wireless
|
| CC-MX-ZC6D-Z1 | Digi ConnectCore 93 System-On-Module — single-core, Ethernet
|
| ACCESSORIES | |
| CC-ACC-LCDH-10 | LCD Application Kit, including 10 in WXGA (high resolution) LCD panel |
