BRESSNER Technology GmbH - Logo

Digi ConnectCore® 6+ series

Embedded system-on-module based on NXP i.MX6Plus

FEATURES

  • System-on-module platform
  • NXP i.MX6Plus Cortex-A9 processor family
  • Intelligent power management architecture
  • Design with IEC 60068 and HALT verification
  • 802.11a/b/g/n and Bluetooth 5®
SKU: 26709

Description

Digi ConnectCore® 6+ Series – Ultra-compact and highly integrated system-on-module solution

The Digi ConnectCore® 6+ is an ultra-compact system-on-module solution based on the powerful NXP i.MX6Plus Cortex-A9 processor family. This series offers scalable quad-core performance and integrated wireless in a reliable form factor.

Powerful processor architecture based on NXP i.MX6 Cortex-A9 processor family

The Digi ConnectCore® 6+ impresses with processor speeds of up to 1.2 GHz and fully pin-compatible dual/quad-core variants. This platform solution ensures future-proof performance for a wide range of applications. The Digi ConnectCore® 6+ impresses with processor speeds of up to 1.2 GHz and fully pin-compatible dual/quad core variants. This platform solution ensures future-proof performance for a wide range of applications.

With pre-certified 802.11a/b/g/n/ac wireless and Bluetooth 5 technology, including Bluetooth Low Energy, the Digi ConnectCore® 6+ provides seamless connectivity for innovative applications and IoT solutions

Compact design for maximum flexibility

The low-profile, surface mount design of the Digi ConnectCore® 6+ maximizes integration flexibility and reduces design risk. Even in demanding quad-core system configurations, the optimized heat dissipation ensures efficient performance.

Trusted embedded device security with Digi TrustFence®

As part of the Digi Yocto Linux platform support, the Digi ConnectCore® 6+ offers integrated cloud management via the scalable Digi Remote Manager®. This enables secure remote management and web service functions for networked devices. The Digi ConnectCore® 6+ relies on Digi TrustFence, a comprehensive software framework, to ensure a secure product platform for embedded devices.

Security is a critical aspect of any connected device. With Digi TrustFence®, Digi ConnectCore® 6+ provides a complete software framework to bring device security into focus. The integration of the U-Boot and Linux platform enables a transparent and future-proof architecture for managed device security. The Digi ConnectCore® 6+ requires zero implementation effort and provides a robust security solution.

The association with trusted partners such as AWS and the status as NXP Gold Partner underline the outstanding performance and reliability of the Digi ConnectCore® 6+ series.

Specifications

Digi ConnectCore® 6+
SPECIFICATIONS
Application processor NXP i.MX6Plus encompasses a quad-core Arm® Cortex®-A9 platform running up to 1.2 GHz with 1 MB of L2 cache, and optimized 64-bit DDR3 or 2-ch., 32-bit LPDDR2 support. Integrated FlexCAN, MLB busses, PCI Express®and SATA-2 provide excellent connectivity
Memory 8 GB flash, 2 GB DDR3
PMIC Dialog DA9063
Graphics LVDS, MIPI display port, MIPI camera port and HDMI v1.4
Security RNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP)
Peripherals / Interfaces MMC 4.4/SD 3.0 x3MMC 4.4/SDXC, UART x5 (5 Mbps), MIPI HSI, S/PDIF Tx/Rx, I2C x3, SPI x5, ESAI, I2S/SSI x3, FlexCAN
x2, MLB150 + DTCP, S-ATA and PHY (3 Gbps), USB2 OTG and PHY, USB 2.0 Host and PHY, USB 2.0 HSIC Host x2, PWM,
3.3V GPIO, Keypad, PCIe 2.0 (x1 lane), HDMI and PHY, MIPI DSI, MIPI CSI2, 20-bit CSI, 24-bit RGB, LVDS (x2), RTC,
External address/data bus, Watchdog, Timers, JTAG
External bus 26-bit address / up to 32-bit data (multiplexed and non-multiplexed modes)
Ethernet 1 Gigabit Ethernet
Wi-Fi 802.11a/b/g/n/ac
Bluetooth® Bluetooth® 5
Operating temperature -40° C to 85° C (-40° F to 185° F); depending on use case and enclosure/system design
Storage temperature -50° C to 125° C (-58° F to 257° F)
Relative humidity 5% to 90% (non-condensing)
Radio approvals US, Canada, EU, Australia/New Zealand
Emissions / Immunity / Safety FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES-003 Class B, VCCI Class II, AS 3548,
FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS- 210 Issue 5 Section 6.2.2(o), EN 300 328,
EN 301 489-17, EN 55024, EN 301 489-3, Safety UL/UR (or equivalent)
Design verification Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/Shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
Mechanical dimensions LGA-400, 2 mm pitch, fully shielded (heat-spreading)
Product warranty 3 year

Documents

Digi ConnectCore 6+ Datasheet
Digi ConnectCore Embedded Feature – Product Comparison (SOMs & SBCs)

Order information

Order information Digi ConnectCore® 6+ series
DEVELOPMENT KIT
CC-WMX6P-KIT Digi ConnectCore 6+ Professional Development Kit
MODULE
CC-WMX-KK8D-TN ConnectCore 6+ module, i.MX6QuadPlus, 800 MHz, -40 to 85° C, 8 GB flash, 2 GB DDR3, 802.11a/b/g/n/ac, Bluetooth 5, Ethernet
ACCESSORIES
CC-ACC-LCDH-10 LCD Application Kit, including 10 in WXGA (high resolution) LCD panel

Resources

Customers were also interested in

Go to Top