- Cost-efficient RF module development kit
- Low power Digi XBee® or XBee®-PRO with extended range
- SiliconLabs EM357 SoC
- 2.4 GHz for worldwide use
- DigiMesh® peer-to-peer mesh network protocol
- Digi Part No.: XK-WDM
Description
Digi XBee® DigiMesh® 2.4 development kit – Maximize your wireless development opportunities
The Digi XBee® DigiMesh® 2.4 development kit is your key to a comprehensive wireless connectivity development experience. With this kit, you can take full advantage of the power and versatility of the Digi XBee® DigiMesh® 2.4 series.
Included in the kit:
- 2x Digi XBee® XB24CDMPIT-001 modules: These high-performance Digi XBee® modules provide a reliable and cost-effective wireless connection in the 2.4 GHz range. With the DigiMesh® network protocol, they enable robust peer-to-peer connections and self-healing networks.
- 1x Digi XBee® XB24DMPIS-001 module: This module completes the development kit and expands the possibilities for wireless connectivity. The integration of DigiMesh® technology makes it ideal for applications that require network stability and high uptime.
Develop wireless applications without limits:
The Digi XBee® DigiMesh® 2.4 development kit enables developers to build wireless solutions characterized by ease of use, flexibility and reliability. Whether you are driving a project in factory automation, a smart home system or any other area, this development kit provides the necessary tools for a smooth implementation.
Key features of the development kit:
- Robust DigiMesh® technology: the XBee modules included in the kit utilize the innovative DigiMesh® network protocol for stable and self-healing wireless connectivity.
- Reliable RF connection: The included modules ensure reliable RF communication in the 2.4 GHz range, ideal for worldwide use and a variety of applications.
- Developer-friendly: This kit allows developers to quickly and easily prototype, test new applications and optimize wireless connectivity solutions.
The Digi XBee® DigiMesh® 2.4 development kit is the perfect starting point for developing wireless applications with high reliability and flexibility. Unleash your development potential and experience the future of wireless connectivity with Digi XBee®.
Digi Part No.: XK-WDM
Specifications
| Digi XBee® S2C DigiMesh® 2.4 | Digi XBee®-PRO S2C DigiMesh® 2.4 | |
|---|---|---|
| PERFORMANCE | ||
| Transceiver chipset | Silicon Labs EM357 SoC | |
| Data rate | RF 250 Kbps, Serial up to 1 Mbps | |
| Indoor/Urban range[1] | Up to 60 m (200 ft) | Up to 90 m (300 ft) |
| Outdoor/RF Line-Of-Sight range[1] | Up to 1200 m (4000 ft) | Up to 3200 m (2 miles |
| Transmit power | 3.1 mW (+5 dBm) / 6.3 mW (+8 dBm) boost mode | 63 mW (+18 dBm) |
| Receiver sensitivity (1% PER) | -100 dBm / -102 dBm boost mode | -101 dBm |
| FEATURES | ||
| Serial data interface | UART, SPI | |
| Configuration method | API or AT commands, local or over-the-air (OTA) | |
| Frequency band | ISM 2.4 GHz | |
| Form factor | Through-Hole, Surface Mount | |
| Hardware | S2C | |
| ADC- inputs | 4x 10-bit ADC inputs | |
| Digital I/O | 15 | |
| Antenna options | Through-Hole: PCB Antenna, U.FL Connector, RPSMA Connector, or Integrated Wire SMT: RF Pad, PCB Antenna, or U.FL Connector |
|
| Operating temperature | -40 ºC to 85 ºC (-40 ºF to 185 ºF) | |
| Dimensions (L x W x H) | Through-Hole: 0.960 x 1.087 in (2.438 x 2.761 cm) SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm) |
Through-Hole: 0.960 x 1.297 in (2.438 x 3.294 cm) SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm) |
| NETWORKING AND SECURITY | ||
| Protocol | XBee 802.15.4 (Proprietary 802.15.4) | |
| Updatable to DigiMesh-Protocol | Yes | |
| Updatable to ZigBee-Protocol | Yes | |
| Interference immunity | DSSS (Direct Sequence Spread Spectrum) | |
| Encryption | 128-Bit AES | |
| Reliable packet delivery | Retries/Acknowledgements | |
| Filtration options | PAN ID, Channel, and 64-bit addresses | |
| Channels | 16 channels | 15 channels |
| POWER REQUIREMENTS | ||
| Supply voltage | 2.1 to 3.6V | 2.7 to 3.6V |
| Transmit current | 33 mA @ 3.3 VDC / 45 mA boost mode | 120 mA @ 3.3 VDC |
| Receive current | 28 mA @ 3.3 VDC / 31 mA boost mode | 31 mA @ 3.3 VDC |
| Power-down current | <1 μA @ 25º C | <1 μA @ 25º C |
| RECULATORY APPROVALS[2] | ||
| FCC, IC (North America) | Yes | Yes |
| ETSI (Europe) | Yes | No |
| RCM (Australia and New Zealand) | No (coming soon) | No (coming soon) |
| Telec (Japan) | No (coming soon) | No (coming soon) |
Order information
| Order information | Digi XBee® S2C DigiMesh® 2.4 series |
|---|---|
| DEVELOPMENT KIT | |
| XK-WDM | Digi XBee S2C DigiMesh 2.4 Development Kit |
| MODULES | |
| XB24CDMPIT-001 | XBee S2C DigiMesh 2.4 through-hole module w/ PCB antenna |
| XB24CDMSIT-001 | XBee S2C DigiMesh 2.4 through-hole module w/ RPSMA connector |
| XB24CDMUIT-001 | XBee S2C DigiMesh 2.4 through-hole module w/ U.fl connector |
| XB24CDMWIT-001 | XBee S2C DigiMesh 2.4 through-hole module w/ wire antenna |
| XB24CDMRIS-001 | XBee S2C DigiMesh 2.4 SMT module w/ RF Pad connector |
| XB24CDMPIS-001 | XBee S2C DigiMesh 2.4 SMT module w/ PCB antenna |
| XB24CDMUIS-001 | XBee S2C DigiMesh 2.4 SMT module w/ U.fl connector |
| ANTENNA | |
| A24-HABUF-P5I | Antenna – 2.4 GHz, half wave dipole, 2.1 dBi, U.FL female, articulating. |
| A24-HASM-450 | Antenna – 2.4 GHz, half wave dipole, 2.1 dBi, RPSMA male, articulating. |
| A24-HASM-525 | Antenna – 2.4 GHz, half wave dipole, 2.1 dBi, RPSMA male, articulating. |
| DC-ANT-24DT | Antenna – Wi-Fi, table-top mount, 2450 Mhz, 0.5 m cable |
| DEVELOPMENT BOARDS | |
| 76000956 | Grove Connector Development Board – XBee, through-hole sockets |
| XBIB-C-SMT | Development board – XBee 3, USB-C, surface-mount socket |
| XBIB-CU-TH | Development board – XBee 3, USB-C, through-hole sockets |
| DIGI XBEE® MULTI PROGRAMMER | |
| XBEE-MP-SMT | Digi XBee Multi Programmer, surface mount (SMT) |
| XBEE-MP-TH | Digi XBee Multi Programmer, through-hole (TH) |
| XBEE-MP-SMTA-PCB | Digi XBee Multi Programmer, surface mount (SMT) printed circuit board |
| XBEE-MP-TH-PCB | Digi XBee Multi Programmer, through-hole (TH) printed circuit board |
