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Digi ConnectCore® 8M Nano development kit

Embedded system-on-module development kit based on NXP i.MX 8M Nano // Digi Part No.: CC-WMX8MN-KIT

FEATURES

  • System-on-module platform development kit
  • NXP® i.MX 8M Nano application processor
  • Seamless cellular modem and Digi XBee® integration
  • Low profile Digi SMTplus® form factor
  • Display and camera capacities
  • Digi Part No.: CC-WMX8MN-KIT
SKU: 25350

Description

Digi ConnectCore® 8M Nano development kit: designing and building connected products made easy

Design and build connected products on an industrial-grade platform with the Digi ConnectCore® 8M Nano development kit. The kit contains everything you need for development and production:

  • Digi ConnectCore® 8M Nano development board
  • Console connection cable
  • Dual-band antenna
  • Power supply and accessories
  • Reference designs for LVDS, HDMI and CAN-FD

Industrial performance and reliability

The kit includes an industrial i.MX 8M Nano Quad Core System-on-Module (SOM) designed for demanding industrial applications.

With Digi Embedded Yocto (Linux®) and full Yocto Project® support, the development kit provides a robust software platform.

Comprehensive security and Microcontroller Assist™

Digi TrustFence®, a comprehensive security system for the Internet of Things (IoT), is integrated to ensure the highest level of protection.

Advanced power management, security features, peripheral support and system reliability are provided by Digi Microcontroller Assist™. Pre-certified dual-band 802.11a/b/g/n/ac and Bluetooth® 5 connectivity enable flexible wireless connectivity.

Seamlessly integrate cloud and edge computing services into your applications.

Advanced interfaces

The dev board includes on-board interfaces for HDMI or LVDS displays as well as Digi XBee® integration to expand wireless connectivity with a global family of modules covering common IoT protocols.

Digi Part No.: CC-WMX8MN-KIT

Specifications

Digi ConnectCore® 8M Nano
SPECIFICATIONS
Application processor NXP® i.MX8 Nano

  • Up to 4x Cortex®-A53 cores at 1.4 GHz
  • 1x Cortex-M7 core at 600 MHz core for real-time processing
Memory Up to 8 GB eMMC, up to 1 GB of LPDDR4 (16-bit)
PMIC NXP PCA9450A
Graphics Graphic Processing Unit:

  • GC7000UL with OpenCL and Vulkan support
  • 2 shader
  • 123 million triangles / sec
  • 0.8 giga pixel / sec
  • 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit
  • Supports OpenGL ES 1.1, 2.0, 3.0, OpenCL
  • Shader clock frequency of 500 MHz

LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI; MIPI DSI (4-lane) with PHY (display interface), MIPI CSI (4-lane) with PHY (camera interface)

Security Digi TrustFence®, TRNG, TrustZone, Secure RTC, Secure JTAG, Secure Element
Peripherals / Interfaces 1x USB 2.0 OTG controllers with integrated PHY interfaces
3x Ultra Secure Digital Host Controller (uSDHC) interfaces
4x Universal Asynchronous Receiver / Transmitter (UART) modules
4x I2C modules
3x SPI modules
1x Quad SPI
10x PWM channels
1x 16-bit ADC module with accurate internal voltage reference, up to 20 channels
5x Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, codec/DSP and DSD interfaces
1x S/PDIF input and output, including a raw capture input mode
8-channel Pulse Density Modulation (PDM) input
Up to 112 GPIOs
Ethernet 1x 10/100/1000M Ethernet + AVB
Wi-Fi 1×1 802.11a/b/g/n/ac dual-band wireless
Bluetooth® Bluetooth® 5
On-Module Microcontroller Digi Microcontroller Assist™

  • Independent Cortex-M0+ microcontroller subsystem
  • Supporting ultra-low power modes at <3 µA
Operating temperature Industrial: -40 °C to 85 °C (-40 °F to 185 °F); depending on use case and enclosure/system design
Storage temperature -50 °C to 125 °C (-58 °F to 257 °F)
Relative humidity 5% to 90% (non-condensing)
Radio approvals US, Canada, EU, Japan, Australia/New Zealand
Emissions / Immunity / Safety FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548; FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1)
Design verification Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
Mechanical dimensions 118 castellated vias, LGA-474, 1.27 mm pitch,
40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in)
Product warranty 3-year

Documents

Digi ConnectCore 8M Nano Development Kit – Datasheet
Digi ConnectCore 8M Nano – Datasheet
Digi ConnectCore Embedded Feature – Product Comparison (SOMs & SBCs)
Digi ConnectCore 8 family – flyer

Order information

Order information Digi ConnectCore® 8M Nano
DEVELOPMENT KIT
CC-WMX8MN-KIT Digi ConnectCore 8M Nano Development Kit
MODULES
CC-WMX-FS7D-NN Digi ConnectCore 8M Nano, Quad Core, 8 GB eMMC, 1 GB LPDDR4, wireless
CC-WMX-FR6D-NN Digi ConnectCore 8M Nano, SoloLite Core, 8 GB eMMC, 512 MB LPDDR4, wireless
CC-MX-FS7D-ZN Digi ConnectCore 8M Nano, Quad Core, 8 GB eMMC, 1 GB LPDDR4, Ethernet
CC-MX-FR6D-ZN Digi ConnectCore 8M Nano, SoloLite Core, 8 GB eMMC, 512 MB LPDDR4, Ethernet
ACCESSORIES
CC-ACC-LCDH-10 LCD Application Kit, including 10 in WXGA (high resolution) LCD panel

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