- Extremely compact: Smallest e.MMC (6.7 mm)
- For compact devices: Wearables & smart glasses
- Up to 70% lower power: Longer battery life
- High data integrity: ECC, wear leveling, data refresh
- 125-ball design: JEDEC compatible
- Easy integration: With LPDDR & SoCs
Description
ATP e.MMC Smaller Footprint – Ultra-compact eMMC storage for wearables and smart devices
BRESSNER Technology introduces the ATP e.MMC Smaller Footprint Series, an ultra-compact 6.7 mm eMMC 5.1 storage solution for smart wearables and other space-constrained devices. Its innovative 6.7 mm package reduces size by 67% compared to conventional eMMC modules.
At the same time, performance, reliability and energy efficiency remain fully uncompromised. Therefore, the compact form factor is ideal for space-critical designs such as smart glasses and other modern wearable technologies.
High performance despite an ultra-compact design
The E700Pc and E600Vc models are based on a 125-ball Fine Ball Grid Array (FBGA). As a result, they remain fully pin-compatible with the JEDEC eMMC 5.1 standard (JESD84-B51).
In addition, the devices support x1, x4 and x8 bus modes and feature HS400 DDR mode. This enables data transfer rates of up to 400 MB/s. Consequently, systems benefit from faster programming and higher bandwidth. Despite the highly miniaturized design, the module ensures stable performance and efficient thermal management.
Power efficiency is another key advantage. Advanced firmware tuning enables faster transitions from active to idle states through Auto Power-Saving Mode. As a result, power consumption can be reduced by up to 70%.
This improvement significantly extends battery life in portable devices. Therefore, the series is particularly suitable for battery-powered wearables.
The ATP e.MMC Smaller Footprint Series is available in two configurations to support different application requirements. The E600Vc provides 64 GB capacity with TLC flash. Meanwhile, the E700Pc operates in pSLC mode with 20 GB capacity and endurance of up to 680 TB. This makes it ideal for write-intensive workloads.
For reliable operation, the 6.7 mm eMMC integrates advanced error correction, wear leveling and dynamic data refresh technologies. These features help ensure data integrity and a long product lifespan.
In addition, the device supports an operating temperature range from −25°C to 85°C. Together with the soldered-down, vibration-resistant design, it provides dependable performance in mobile and demanding environments.
Specifications
| ATP e.MMC Smaller Footprint Series | ||||||
|---|---|---|---|---|---|---|
| FEATURES | ||||||
| Product Line | Premium | Value | Premium | Value | ||
| Model | E700Pc | E600Vc | E700Pc | E600Vc | E600Vi | E600Vc |
| Flash Type | 3D TLC (pSLC Mode) | 3D TLC | 3D TLC (pSLC Mode) | 3D TLC | ||
| IC Package | 125-ball FBGA | 153-ball FBGA | ||||
| JEDEC Specification | v5.1, HS400 | |||||
| Power Loss Protection | Firmware-based | |||||
| Operating Temperature | -25°C to 85°C | -40°C to 85°C | -25°C to 85°C | |||
| Capacity | 20 GB | 64 GB | 20 GB to 40 GB | 64 GB to 128 GB | 32 GB to 64 GB | |
| PERFORMANCE | ||||||
| Sequential Read/Write up to (MB/s) | 240 / 210 | 240 / 220 | 290 / 225 | |||
| Bus Speed Modes | x1 / x4 / x8 | |||||
| ICC (typ. RMS Read/Write) mA (max.) | 30 / 40 | 35 / 45 | 100 / 110 | |||
| ICCQ (typ. RMS Read/Write) mA (max.) | 60 / 50 | 60 / 55 | 105 / 100 | |||
| ENDURANCE & RELIABILITY | ||||||
| Endurance TBW (max.) | 680 TB | 12 TB | 1,360 TB | 24 TB | 55 TB | |
| Reliability MTBF @ 25°C | > 3,000,000 hours | > 2,000,000 hours | ||||
| OTHERS | ||||||
| Dimensions (mm) | 6.7 × 7.2 × 0.65 | 7.2 × 7.2 × 0.8 | 9.0 × 10.0 × 0.8 | |||
| Certifications | RoHS, REACH | |||||
| Warranty | 1 year | |||||
