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Digi XBee® 3 Global LTE Cat 4 3G/2G

High-performance LTE Cat 4 module for global IoT connectivity without SIM // Digi Part No.: XB3-C-G4-UT-001

FEATURES

  • High-performance cellular module for IoT and M2M applications with global LTE Cat 4 support
  • Multi-band connectivity with 2G and 3G fallback for maximum network coverage applications
  • Enhanced IoT security with Digi TrustFence® for protected data transmission
  • MicroPython integration for flexible programming and customization
  • Digi Part No.: XB3-C-G4-UT-001
SKU: 28894

Description

Digi XBee® 3 Global LTE Cat 4 3G/2G – High-performance cellular connectivity for IoT and M2M

The Digi XBee® 3 Global LTE Cat 4 3G/2G module provides developers, OEMs and solution providers with a high-performance, pre-certified cellular solution that enables easy integration into IoT and M2M applications. Thanks to industry-leading LTE technology and 3G/2G fallback, devices can seamlessly switch between multiple networks to ensure maximum flexibility and global connectivity.

Optimal network coverage with multi-band support

The Digi XBee 3 Global LTE Cat 4 3G/2G modules are ideal for applications with variable bandwidth usage from 100 MB up to 1 GB per month. They offer a cost-effective alternative to traditional LTE modules without compromising on performance or coverage. The integrated 3G/2G fallback ensures that connectivity is maintained even in regions with limited LTE coverage.

Centralized management with Digi Remote Manager®

Digi Remote Manager® allows all Digi XBee 3 Global LTE Cat 4 3G/2G modules to be configured, updated and controlled via a centralized platform. This simplifies management and enables efficient maintenance and scaling in large-scale IoT installations.

Security at the highest level with Digi TrustFence®

The integrated Digi TrustFence® security architecture provides comprehensive protection for IoT and M2M applications. With multiple security, identity and data protection mechanisms, TrustFence® protects against current and future cyber threats and ensures secure data transmission.

Easy development and scaling

Digi XBee’s standard API frames and AT commands, along with MicroPython integration and Digi XBee Studio, make it easy to quickly set up, configure and test modules. Developers benefit from reduced development time and easy scalability.

Part of the powerful Digi XBee ecosystem

The Digi XBee 3 Global LTE Cat 4 3G/2G module is a key component of the Digi XBee Ecosystem, which includes a variety of wireless modules, adapters, tools and software solutions. These enable accelerated product development, easy deployment and efficient management of IoT solutions.

Digi XBee 3 Global LTE Cat 4 3G/2G – The optimal choice for high-performance, secure and scalable cellular connectivity in IoT and M2M applications.

Digi Part No.: XB3-C-G4-UT-001

Specifications

Digi XBee® 3 Zigbee 3.0 Digi XBee® 3 PRO Zigbee 3.0
PERFORMANCE
Transceiver chipset Silicon Labs EFR32MG SoC
Date rate RF 250 Kbps, serial up to 1 Mbps
Indoor/urban range[1] Up to 60 m (200 ft) Up to 90 m (300 ft)
Outdoor/RF Line-Of-Sight range[1] Up to 1200 m (4000 ft) Up to 3200 m (2 miles)
Transmit power +8 dBm +19 dBm
Receiver sensitivity (1% PER) -103 dBm normal mode
BLUETOOTH® PERFORMANCE
Transceiver chipset Silicon Labs EFR32MG SoC
BLE version Supports BLE 4.2 and capable of interoperating with BLE 5.0 devices that support 1M PHY. Hardware is software upgradable to 5.0, but not yet enabled except payload extensions (future release).
Maximum data range 1 Mbps
Indoor/urban range[1] Up to 15 m (49 ft)
Outdoor/RF Line-Of-Sight range[1] Up to 300 m (984 ft)
Transmit power +8 dBm
Receiver sensitivity (1% PER) -95 dBm normal mode
FEATURES
Serial data interface UART, SPI, I2C
Configuration method API or AT commands, local or over-the-air (OTA)
Frequency band ISM 2.4 GHz
Form factor Micro, through-hole, surface mount
Interference immunity DSSS (Direct Sequence Spread Spectrum)
ADC inputs 4x 10-bit ADC inputs
Digital I/O 15
Antenna options Through-hole: PCB Antenna, U.FL Connector, RPSMA Connector
SMT: RF Pad, PCB Antenna, or U.FL Connector
Micro: U.FL Antenna, RF Pad, Chip Antenna
Operating temperature -40 ºC to 85 ºC (-40 ºF to 185 ºF)
Dimensions (L x W x H) Through-Hole: 2.438 x 2.761 cm (0.960 x 1.087 in)
SMT: 2.199 x 3.4 x 0.305 cm (0.866 x 1.33 x 0.120 in)
Micro: 13 x 19 x 2 mm (0.533 x 0.76 x 0.087 in)
PROGRAMMANILITY
Memory 1 MB / 128 KB RAM (32 KB are available for MicroPython)
NETWORKING AND SECURITY
Protocol Zigbee 3.0
Encryption 128/256 bit AES
Reliable packet delivery Retries/acknowledgements
IDS PAN ID and addresses, cluster IDs and endpoints (optional)
Channels 16 channels
POWER REQUIREMENTS
Supply voltage 2.1 to 3.6 V
Transmit current 40 mA at 8 dBm 140 mA at 19 dBm
Receive current 17 mA
Power-down current 2 micro Amp at 25 ºC (77 ºF)
REGULATORY APPROVALS[2]
FCC, IC (North America) Yes Yes
ETSI (Europe) Yes No
RCM (Australia) Yes Yes
Anatel (Brazil) Yes Yes
Teleck MIC (Japan) Yes No
KCC (South Korea) Yes No
[1] Range figure estimates are based on free-air terrain with limited sources of interference. Actual range will vary based on transmitting power, orientation of transmitter and receiver, height of transmitting antenna, height of receiving antenna, weather conditions, interference sources in the area, and terrain between receiver and transmitter, including indoor and outdoor structures such as walls, trees, buildings, hills, and mountains.

[2] Visit https://www.digi.com/resources/certifications for latest certifications

Documents

Digi XBee 3 Global LTE Cat 4 Datasheet
Digi XBee 3 Global LTE Cat 4 Dev Kit Datasheet

Order information

Order information Digi XBee® 3 Global LTE Cat 4
DEVOLPMENT KIT
XK3-C-G4-UT-W Digi XBee 3 Global LTE Cat 4 Development Kit with Digi XBee 3 Global Cat 4 module, antennas (2 cellular U.FL and 1 GNSS U.FL) and development board (XBIB-CU-TH)
MODULES
XB3-C-G4-UT-001 Digi XBee 3 Global LTE Cat 4, 3G / 2G, GNSS, no SIM
XB3-C-G4-UT-101 Digi XBee 3 Global LTE Cat 4, 3G / 2G, GNSS, AT&T SIM
XB3-C-G4-UT-102 Digi XBee 3 Global LTE Cat 4, 3G / 2G, GNSS, Verizon SIM
DEVELOPMENT BOARDS
XBIB-CU-TH Development board – XBee 3, USB-C, through-hole sockets
DIGI XBEE® MULTI PROGRAMMER
XBEE-MP-TH Digi XBee Multi Programmer, through-hole (TH)
XBEE-MP-TH-PCB Digi XBee Multi Programmer, through-hole (TH) printed circuit board

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