- Embedded system-on-modules with industrial-grade, scalable platform
- STM32MP25 MPU with integrated NPU and ISP for edge AI
- Pre-certified dual-band Wi-Fi 6 (802.11ax) and Bluetooth® 5.4
- Compact Digi SMTplus® form factor (30 x 30 mm) for space-saving designs
- 3D GPU, video encoder/decoder (VPU) and high-resolution MIPI, LVDS and parallel display interfaces
FEATURES
Description
Digi ConnectCore® MP2 – Powerful and secure system-on-modules for industry and IoT
The Digi ConnectCore® MP2 series is based on the STM32MP25 processor from STMicroelectronics and integrates a neural processing unit (NPU) and an image signal processor (ISP). This powerful architecture enables AI-powered image processing, machine learning and computer vision applications, ideal for Industry 4.0 and smart IoT solutions.
Pre-certified wireless connectivity includes dual-band Wi-Fi 6 (tri-band 6E ready) and Bluetooth 5.4. In addition, PCIe Gen2, USB 3.0, CAN-FD and Gigabit Ethernet with TSN support are reserved to enable seamless communication in networked systems.
Compact design for flexible integration
With a 30 x 30 mm SMTplus® form factor, the ConnectCore MP2 series is ideal for space-saving industrial and portable devices. Thanks to the energy-efficient system design, it is perfect for battery-powered applications and reduces energy consumption without sacrificing performance.
Integrated security with Digi TrustFence®
The Digi TrustFence® framework, which offers integrated encryption, identity management and data protection, ensures maximum security. In combination with Digi ConnectCore Cloud Services, it enables a secure, scalable and easy-to-manage IoT infrastructure.
Durability and easy development with Digi Embedded Yocto®
The Digi ConnectCore® MP2 series is designed for 24/7/365 operation in industrial environments and offers a service life of over 10 years. Thanks to Digi Embedded Yocto® and Digi ConnectCore Cloud Services, product development is simplified, enabling OEMs to create market-ready solutions faster and more securely.
With Digi Wireless Design Services (WDS), Digi also offers customization, certification support and development consulting to ensure optimal time-to-market and scalability.
Specifications
| Digi ConnectCore® MP225 SOM | |
|---|---|
| SPECIFICATIONS | |
| Application processor | STMicroelectronics STM32MP255C, Arm® 64-bit dual Cortex®-A35 at 1.2 GHz; Cortex-M33 at 400 MHz with FPU/MPU; Cortex M0+ at 200 MHz in SmartRun domain |
| Memory | Up to 128 GB Flash (eMMC™), up to 2 GB DDR4 (16-bit) |
| PMIC | STMicroelectronics Power Management IC — STPMIC25A |
| Artificial Intelligence | Neural Processing Unit (NPU) — VeriSilicon® at 800 MHz, 1.2 TOPS |
| Video / Graphics | 3D GPU — VeriSilicon at 800 MHz; OpenGL® ES 3.2.8 — Vulkan 1.2; Open CL™ 3.0, OpenVX™ 1.3; up to 138 Mtriangle/s, 900 Mpixel/s; LCD-TFT controller, up to 24-bit digital RGB888; up to FHD (1920 x 1080) at 60 fps, 3 layers including a secure layer; YUV support, 90° output rotation; MIPI DSI®, 4x data lanes, up to 2.5 Gbit/s each; up to QXGA (2048 x 1536) at 60 fps; FPD-1 and OpenLDI JEIDA/VESA (LVDS), 1x link of 4x data lanes, up to 1.1 Gbit/s each, up to 1080p at 60 fps |
| Camera | Camera interface #1 (5 Mpixels at 30 fps); MIPI CSI-2®, 2x data lanes up to 2.5 Gbit/s each; 8- to 16-bit parallel, up to 120 MHz; RGB, YUV, JPG, RawBayer with basic ISP, downscaling, cropping, 3-pixel pipelines; Camera interface #2 (1 Mpixels at 15 fps); 8- to 14-bit parallel, up to 80 MHz; RGB, YUV, JPG, cropping; Digital parallel interface up to 16-bit input or output |
| Security | Secure boot, TrustZone® peripherals, up to 8 tamper input pins + 8 active tamper output pins, 1x CRC calculation unit, 2x cryptographic processors, hardware acceleration with DMA support; environmental monitors, display secure layers; Encryption/decryption: AES-128/192/256, DES/TDES; secure AES-256 with SCA; RSA, ECC, ECDSA with SCA; HASH (SHA-1, SHA-224, SHA-256, SHA3), HMAC; true random number generator; “on-the-fly” DDR encryption/decryption (AES-128); “on-the-fly” OTFDEC Octo-SPI flash memory decryption (AES-128); Complete resource isolation framework; Digi TrustFence embedded security framework |
| Peripherals / Interfaces | 8x I2C FM+ (1 Mbit/s, SMBus/PMBus®); 4x I3C (12.5 Mbit/s); 5x UART + 4x USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave); 8x SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock); 4x SAI (stereo audio: I2S, PDM, SPDIF Tx); SPDIF Rx with 4 inputs; 3x SDMMC up to 8-bit, out of which one is used for eMMC and one for Wi-Fi; up to 3x CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN); 1x USB 2.0 high-speed Host with embedded 480 Mbits/s PHY; 1x USB 2.0/3.0 high-speed/SuperSpeed dual role data with embedded 480 Mbits/s and 5 Gbits/s PHY (5 Gbits/s PHY shared with PCI Express); 1x USB Type-C® Power Delivery control with two CC lines PHY; 1x PCI Express with embedded 5 Gbits/s PHY (PHY shared with USB 3.0 SuperSpeed); up to 172 secure I/O ports with interrupt capability; up to 6 wake-up inputs; up to 8 tamper input pins + 8 active tamper output pins; 3x ADCs with 12-bit max. resolution (up to 5 Msps each, up to 24 channels); Internal temperature sensor; 1x multifunction digital filter (MDF) with up to 8 channels/8 filters; 1x audio digital filter with 1 filter and sound activity detection; Internal or external ADC reference VREF+; 4x 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input; 3x 16-bit advanced motor control timers; 10x 16-bit general-purpose timers (including 2 basic timers without PWM); 5x 16-bit low-power timers; Secure RTC with subsecond accuracy and hardware calendar; up to 2x 4 Cortex-A35 system timers (secure, non-secure, virtual, hypervisor); 2x SysTick M33 timer (secure, non-secure); 1x SysTick M0+ timer; 7x watchdogs (5x independent and 2x window) |
| Ethernet | 2x Gigabit Ethernet with external PHY interfaces, optional 3x Gigabit Ethernet GMAC interfaces and 2+1 switch with STM32MP25 MPU, TSN, IEEE 1588v2 hardware, MII/RMII/RGMII |
| Wi-Fi | Pre-certified dual-band Wi-Fi 6 (tri-band 6E ready) 802.11a/b/g/n/ac/ax 1×1 radio (up to 433.3 Mbps) with strong WPA3-Enterprise authentication/encryption; −40 °C to 85 °C (−40 °F to 185 °F) full temperature range; Bluetooth 5.4 (Basic Rate, Enhanced Data Rate and Bluetooth Low Energy) |
| Operating temperature | Industrial: −40 °C to 85 °C (−40 °F to 185 °F); depending on use case and enclosure/system design |
| Storage temperature | −50 °C to 125 °C (−58 °F to 257 °F) |
| Relative humidity | 5% to 90% (non-condensing) |
| Radio approvals | US, Canada, EU, Japan, Australia/New Zealand, Brazil, Mexico |
| Emissions / Immunity / Safety | FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548 FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024 EN 301 489-3, Safety (IEC 62368-1); visit product certifications for latest updates |
| Design verification | Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78; vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT |
| Mounting / Pin count | Digi SMTplus (30 mm x 30 mm) surface mount footprint using 333-pad LGA (1.27 mm pitch) with option for simple carrier board designs supporting subset of interfaces |
| Mechanical dimensions | 30 mm x 30 mm x 3 mm (1.18 in x 1.18 in x 0.12 in) |
| Product warranty | 3-year |
Order information
| Order information | Digi ConnectCore® MP2 series |
|---|---|
| DEVELOPMENT KIT | |
| CC-WMP255-KIT | Digi ConnectCore MP255 Development Kit
|
| MODULES | |
| CC-WST-J17D-NK | Digi ConnectCore MP255 Secure Wireless System-On-Module
|
| CC-ST-J17D-ZK | Digi ConnectCore MP255 Secure Ethernet System-On-Module
|
| ACCESSORIES | |
| CC-ACC-LCDH-10 | LCD Application Kit, including 10 in WXGA (high resolution) LCD panel |
