- Scalable and wireless system-on-modules
- NXP i.MX 93 single/dual-core application processor
- Low-profile Digi SMTplus™
- Dual-band Wi-Fi and Bluetooth 5.3®
- Integration of cellular modem and Digi XBee®
- Digi Part No.: CC-WMX-ZC6D-L1
FEATURES
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Product: Digi ConnectCore® 93 Single-Core Wi-Fi
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Product: Digi ConnectCore® 93 Single-Core Wi-Fi
SKU: No variant available
Description
Digi ConnectCore® 93 Single-Core & Wi-Fi – Embedded System-on-Module based on the NXP i.MX 93 processor with AI/ML NPU for industrial applications
The Digi ConnectCore® 93 System-On-Module (SOM) defines a new dimension in wireless connectivity and performance. Based on the NXP i.MX 93 processor, this single-core SOM offers a reliable and efficient solution for embedded systems. At the heart of the module is the NXP i.MX 93 processor, which guarantees reliable computing power. With 8 GB flash memory (eMMC) and 512 MB LPDDR4/LPDDR4X RAM, the SOM offers sufficient capacity for demanding applications.
Versatile connectivity in a compact design
With two Gigabit Ethernet ports, the Digi ConnectCore® 93 SOM enables fast and reliable wired connectivity. The module is also equipped with Wi-Fi 6 (802.11ax) and Bluetooth 5.3 to enable wireless applications at the highest level.
The Digi ConnectCore® 93 93 SOM is designed to integrate seamlessly into a wide range of applications. Its compact design and reliability make it the ideal choice for embedded systems that require wireless connectivity.
Integrated security in one module
Thanks to the integrated Digi TrustFence® technology, the module offers advanced security features that ensure the protection of connected devices and simplify the development process. Whether in industrial, medical, energy or transportation applications, the Digi ConnectCore® 93 SOM is designed to meet diverse application requirements and provide a robust, long-term solution for embedded systems.
Digi Part No.: CC-WMX-ZC6D-L1
Specifications
Digi ConnectCore® 93 | |
---|---|
FEATURES | |
Application processor | NXP® i.MX 93
|
Memory | Up to 32 GB flash (eMMC), up to 2 GB LPDDR4 / LPDDR4X (16-bit) |
NPU | AI/ML Arm® Ethos U65 micro neural processor |
PMIC | NXP PCA9451 |
Graphics / Display | 2D Engine:
1x 1080p 60 MIPI DSI (4-lane, 1.5 Gbps/lane) with PHY |
Camera | 1x 1080p 60 MIPI-CSI (2-lane, 1.5 Gbps/lane) with PHY 8-bit parallel YUV/RGB |
Security | Digi TrustFence®: secure boot, filesystem encryption, tamper detection, secure JTAG, secure console, secure build environments, secure firmware updates; EdgeLock secure enclave: crypto, tamper detection, secure clock, secure boot, eFuse key storage, random number; Arm TrustZone (Cortex-A and Cortex-M) |
Peripherals / Interfaces | 2x USB 2.0 OTG controllers with integrated PHY interfaces 1x Ultra Secure Digital Host Controller (uSDHC) interfaces 8x Low Power Universal Asynchronous Receiver / Transmitter (LPUART) modules 8x Low Power I2C modules, 2x I3C 8x Low Power SPI (LPSPI) modules 2x FlexCAN with flexible data-rate (FD) support 4x pulse-width modulator (PWM) with 16-bit counter 1x 12-bit ADC module with accurate internal voltage reference, up to 4 channels 3x Synchronous Audio Interface (SAI) modules (up to 4 lanes) supporting I2S, AC97, TDM, codec/DSP and DSD interfaces 1x S/PDIF input and output, including a raw capture input mode 8-channel Pulse Density Modulation (PDM) input Up to 112 GPIOs |
Ethernet | 2x 10/100/1000M Ethernet with EEE, AVB and IEEE 1588 (1x TSN) |
Wi-Fi | Wi-Fi 6 802.11ax dual-band 1×1 wireless |
Bluetooth® | Bluetooth® 5.3 |
802.15.4 | 802.15.4 (optional) |
On-module microcontroller assist | Digi Microcontroller Assist™ for advanced power management, security, peripheral support and system reliability (optional)
|
Operating temperature | Industrial: −40 °C to 85 °C (−40 °F to 185 °F); depending on use case and enclosure/system design |
Storage temperature | −50 °C to 125 °C (−58 °F to 257 °F) |
Relative humidity | 5% to 90% (non-condensing) |
Radio approvals[1] | US, Canada, EU, Japan, Australia/New Zealand, Brazil, Mexico |
Emissions / Immunity / Safety [1] | FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1) |
Design verification [1] | Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 Vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT |
Mechanical dimensions | 118 castellated vias, LGA-474, 1.27 mm pitch, 40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in) |
Product warranty | 3-year |
[1] Visit product certifications for latest updates.
Order information
Order information | Digi ConnectCore® 93 series |
---|---|
DEVELOPMENT KIT | |
CC-WMX93-KIT | Digi ConnectCore 93 Development Kit
|
MODULES | |
CC-WMX-YC7D-KN | Digi ConnectCore 93 System-On-Module — dual-core, NPU, wireless
|
CC-MX-YC7D-ZN | Digi ConnectCore 93 System-On-Module — dual-core, NPU, Ethernet
|
CC-WMX-ZC6D-L1 | Digi ConnectCore 93 System-On-Module — single-core, wireless
|
CC-MX-ZC6D-Z1 | Digi ConnectCore 93 System-On-Module — single-core, Ethernet
|
ACCESSORIES | |
CC-ACC-LCDH-10 | LCD Application Kit, including 10 in WXGA (high resolution) LCD panel |
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