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Digi ConnectCore® 8M Nano SoloLite Core

Embedded system-on-modules based on NXP i.MX 8M Nano processor // Digi Part No.: CC-MX-FR6D-ZN

FEATURES

  • System-on-Module platform
  • NXP® i.MX 8M Nano application processor
  • Seamless cellular modem and Digi XBee® integration
  • Low profile Digi SMTplus® form factor
  • Display and camera capacities
  • Digi Part No.: CC-MX-FR6D-ZN
SKU: 26372

Description

Digi ConnectCore® 8M Nano – SoloLite Core: Powerful and compact system-on-module for networked embedded systems

The Digi ConnectCore® 8M Nano series sets new standards for integrated System-on-Module (SoM) platforms and is based on the NXP® i.MX 8M Nano processor, which is optimized for modern, networked applications.

Highlights and application areas:

  • High memory capacity and storage options: Equipped with 8 GB eMMC and 512 MB LPDDR4, the module offers enough memory for demanding applications, while focusing on energy efficiency.
  • Future-proof platform: The NXP i.MX 8M Nano processor with SoloLite core ensures reliable performance and supports applications in the areas of IoT, human-machine interface (HMI), audio/voice applications and edge computing.
  • Industrial-grade connectivity: With integrated Ethernet connectivity and an extended range of interfaces, the Digi ConnectCore® 8M Nano is ideal for networked applications in industry, medical technology, agriculture and transportation.
  • Durability and industrial reliability: Designed for a life cycle of over 10 years, the module is the ideal choice for long-life embedded applications that demand reliable performance and stability.

Efficient and secure:

The Digi ConnectCore® 8M Nano SoloLite Core not only provides OEMs with cost savings, but also offers comprehensive security features through the Digi TrustFence® security framework. The combination of pre-certified wireless connectivity and a complete Linux® software platform based on the Yocto Project® makes the platform ideal for fast and secure development of modern embedded solutions.

Digi Part No.: CC-MX-FR6D-ZN

Specifications

Digi ConnectCore® 8M Nano
SPECIFICATIONS
Application processor NXP® i.MX8 Nano

  • Up to 4x Cortex®-A53 cores at 1.4 GHz
  • 1x Cortex-M7 core at 600 MHz core for real-time processing
Memory Up to 8 GB eMMC, up to 1 GB of LPDDR4 (16-bit)
PMIC NXP PCA9450A
Graphics Graphic Processing Unit:

  • GC7000UL with OpenCL and Vulkan support
  • 2 shader
  • 123 million triangles / sec
  • 0.8 giga pixel / sec
  • 12.8 GFLOPs 32-bit / 12.8 GFLOPs 16-bit
  • Supports OpenGL ES 1.1, 2.0, 3.0, OpenCL
  • Shader clock frequency of 500 MHz

LCDIF display controller, supporting up to 1080p 60fps display through MIPI DSI; MIPI DSI (4-lane) with PHY (display interface), MIPI CSI (4-lane) with PHY (camera interface)

Security Digi TrustFence®, TRNG, TrustZone, Secure RTC, Secure JTAG, Secure Element
Peripherals / Interfaces 1x USB 2.0 OTG controllers with integrated PHY interfaces
3x Ultra Secure Digital Host Controller (uSDHC) interfaces
4x Universal Asynchronous Receiver / Transmitter (UART) modules
4x I2C modules
3x SPI modules
1x Quad SPI
10x PWM channels
1x 16-bit ADC module with accurate internal voltage reference, up to 20 channels
5x Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, codec/DSP and DSD interfaces
1x S/PDIF input and output, including a raw capture input mode
8-channel Pulse Density Modulation (PDM) input
Up to 112 GPIOs
Ethernet 1x 10/100/1000M Ethernet + AVB
Wi-Fi 1×1 802.11a/b/g/n/ac dual-band wireless
Bluetooth® Bluetooth® 5
On-Module Microcontroller Digi Microcontroller Assist™

  • Independent Cortex-M0+ microcontroller subsystem
  • Supporting ultra-low power modes at <3 µA
Operating temperature Industrial: -40 °C to 85 °C (-40 °F to 185 °F); depending on use case and enclosure/system design
Storage temperature -50 °C to 125 °C (-58 °F to 257 °F)
Relative humidity 5% to 90% (non-condensing)
Radio approvals US, Canada, EU, Japan, Australia/New Zealand
Emissions / Immunity / Safety FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548; FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1)
Design verification Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
Mechanical dimensions 118 castellated vias, LGA-474, 1.27 mm pitch,
40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in)
Product warranty 3-year

Documents

Digi ConnectCore 8M Nano Development Kit – Datasheet
Digi ConnectCore 8M Nano – Datasheet
Digi ConnectCore Embedded Feature – Product Comparison (SOMs & SBCs)
Digi ConnectCore 8 family – flyer

Order information

Order information Digi ConnectCore® 8M Nano
DEVELOPMENT KIT
CC-WMX8MN-KIT Digi ConnectCore 8M Nano Development Kit
MODULES
CC-WMX-FS7D-NN Digi ConnectCore 8M Nano, Quad Core, 8 GB eMMC, 1 GB LPDDR4, wireless
CC-WMX-FR6D-NN Digi ConnectCore 8M Nano, SoloLite Core, 8 GB eMMC, 512 MB LPDDR4, wireless
CC-MX-FS7D-ZN Digi ConnectCore 8M Nano, Quad Core, 8 GB eMMC, 1 GB LPDDR4, Ethernet
CC-MX-FR6D-ZN Digi ConnectCore 8M Nano, SoloLite Core, 8 GB eMMC, 512 MB LPDDR4, Ethernet
ACCESSORIES
CC-ACC-LCDH-10 LCD Application Kit, including 10 in WXGA (high resolution) LCD panel

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