- Digi XBee 3® Global LTE-M/NB-IoT development kit
- SIM card included in the scope of delivery
- Boards, antennas and other accessories
- 3 months free mobile service
- Digi Part No.: XK3-C-GM2-UT-W
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Product: Digi XBee 3® Global LTE-M/NB-IoT development kit
SKU: No variant available
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Product: Digi XBee 3® Global LTE-M/NB-IoT development kit
SKU: No variant available
Description
Digi XBee 3® Global LTE-M/NB-IoT development kit: Simple and fast integration of cellular connectivity for OEMs
The Digi XBee 3 Global LTE-M/NB-IoT development kit offers OEMs a quick and easy way to integrate cellular connectivity into their devices. The Digi XBee® 3 Global LTE-M/NB-IoT Embedded Smart Modems combine the power and flexibility of the Digi XBee ecosystem with the latest LTE cellular technology, allowing OEMs to quickly integrate state-of-the-art LTE cellular technology into their devices and applications and avoid the time-consuming and costly FCC and carrier terminal certification process.
Contents of the Digi XBee 3 Global LTE-M/NB-IoT development kit:
- Power supply: Power supply unit with plug tips for US, UK, EU, AU
- Antennas: 1 U.FL mobile radio antenna, 1 U.FL Bluetooth® antenna, 1 U.FL GNSS antenna
- Cable: Cat 6 patch cable, 2 m, black, flat
- Modem and accessories: Digi XBee 3 Global LTE-M/NB-IoT embedded modem, development board, SIM card, antennas and power cable
- Extras: 3 months free mobile service* and free circuit diagram check by Digi WDS**
This kit is ideal for hardware and software engineers, enterprise technologists, teachers and students looking to enter the world of embedded wireless technology.
Easy integration and advanced features
With the full suite of standard Digi XBee API frames and AT commands, MicroPython and Digi XCTU®, the Digi XBee 3 Global LTE-M/NB-IoT development kit enables seamless integration into your projects. The kit also offers the flexibility to switch between different radio protocols or migrate to LTE Cat 1.
Technical specifications
Hardware:
- Mobile radio chipset: Telit ME310-WW
- Form factor: Digi XBee® 20-pin through-hole
- Dimensions: 24.38 mm x 32.94 mm
- Operating temperature: -40 ºC to 85 ºC
- Interfaces: UART, SPI, USB
Mobile radio features:
- Supported bands: Bands 1, 2, 3, 4, 5, 8, 12, 13, 18, 19, 20, 25, 26, 27, 28, 66, 71 and 85
- Downlink/uplink speeds (LTE-M): Up to 588 kbps downlink, up to 1 Mbps uplink
- Downlink/uplink speeds (NB-IoT): Up to 120 kbps downlink, up to 160 kbps uplink
- Downlink/uplink speeds (2G): Up to 264 kbps downlink, up to 210 kbps uplink
- Power requirement: 3.3 to 4.3 VDC supply voltage, peak current: 550 mA
Regulatory approvals:
- FCC, ISED, CE/RED, UKCA, PTCRB, AT&T, Verizon
Take advantage of the Digi XBee 3 Global LTE-M/NB-IoT development kit and future-proof your designs. Digi Remote Manager® allows you to centrally configure, deploy and manage your devices.
*Service is limited to ~5 MB/month and limited SMS. For testing purposes only; not for production.
**Level 1 verification.
Digi Part No.: XK3-C-GM2-UT-W
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