- Complete development kit with XBee 3 Global LTE Cat 4 module, boards, antennas and accessories
- Supports global LTE Cat 4 networks with multi-band functionality for maximum compatibility
- SIM card included with 3 months free cellular service
- Easy programming with integrated MicroPython support and standard API frames
- Digi Part No.: XK3-C-G4-UT-W
FEATURES
Description
Digi XBee® 3 Global LTE Cat 4 development kit – Optimized cellular connectivity for IoT and M2M
The Digi XBee® 3 Global LTE Cat 4 development kit provides developers with a powerful, pre-certified platform for integrating cellular solutions into IoT and M2M applications. It enables easy and efficient development with industry-leading LTE technology that allows devices to seamlessly switch between multiple frequencies and wireless protocols.
Ideal for variable bandwidth usage
The Digi XBee 3 Global LTE Cat 4 development kit is ideal for applications with bandwidth requirements from 100 MB up to 1 GB per month. It offers a cost-effective alternative to conventional LTE modules while ensuring maximum performance and network coverage.
Efficient management with Digi Remote Manager®
With Digi Remote Manager®, all Digi XBee 3 Global LTE Cat 4 modules can be centrally configured, updated and monitored. This simplifies device management and enables scalable maintenance for large-scale IoT installations.
Highest security standards with Digi TrustFence®
The integrated Digi TrustFence® security architecture protects IoT and M2M applications with a combination of modern security, identity and data protection mechanisms. This ensures secure and reliable data transmission.
Simple development and scaling
Digi XBee’s standard API frames and AT commands, as well as MicroPython integration and Digi XBee Studio, greatly simplify rapid module setup, configuration and testing. This shortens development time and supports smooth scaling.
Part of the powerful Digi XBee ecosystem
The Digi XBee 3 Global LTE Cat 4 development kit is a key component of the Digi XBee Ecosystem, which includes a variety of wireless modules, adapters, tools and software solutions. These enable accelerated product development, easy deployment and efficient management of IoT solutions.
Digi XBee 3 Global LTE Cat 4 Development Kit – The optimal choice for developers who want to realize secure, scalable and high-performance wireless solutions for IoT and M2M applications.
Digi Part No.: XK3-C-G4-UT-W
Specifications
| Digi XBee® 3 Zigbee 3.0 | Digi XBee® 3 PRO Zigbee 3.0 | |
|---|---|---|
| PERFORMANCE | ||
| Transceiver chipset | Silicon Labs EFR32MG SoC | |
| Date rate | RF 250 Kbps, serial up to 1 Mbps | |
| Indoor/urban range[1] | Up to 60 m (200 ft) | Up to 90 m (300 ft) |
| Outdoor/RF Line-Of-Sight range[1] | Up to 1200 m (4000 ft) | Up to 3200 m (2 miles) |
| Transmit power | +8 dBm | +19 dBm |
| Receiver sensitivity (1% PER) | -103 dBm normal mode | |
| BLUETOOTH® PERFORMANCE | ||
| Transceiver chipset | Silicon Labs EFR32MG SoC | |
| BLE version | Supports BLE 4.2 and capable of interoperating with BLE 5.0 devices that support 1M PHY. Hardware is software upgradable to 5.0, but not yet enabled except payload extensions (future release). | |
| Maximum data range | 1 Mbps | |
| Indoor/urban range[1] | Up to 15 m (49 ft) | |
| Outdoor/RF Line-Of-Sight range[1] | Up to 300 m (984 ft) | |
| Transmit power | +8 dBm | |
| Receiver sensitivity (1% PER) | -95 dBm normal mode | |
| FEATURES | ||
| Serial data interface | UART, SPI, I2C | |
| Configuration method | API or AT commands, local or over-the-air (OTA) | |
| Frequency band | ISM 2.4 GHz | |
| Form factor | Micro, through-hole, surface mount | |
| Interference immunity | DSSS (Direct Sequence Spread Spectrum) | |
| ADC inputs | 4x 10-bit ADC inputs | |
| Digital I/O | 15 | |
| Antenna options | Through-hole: PCB Antenna, U.FL Connector, RPSMA Connector SMT: RF Pad, PCB Antenna, or U.FL Connector Micro: U.FL Antenna, RF Pad, Chip Antenna |
|
| Operating temperature | -40 ºC to 85 ºC (-40 ºF to 185 ºF) | |
| Dimensions (L x W x H) | Through-Hole: 2.438 x 2.761 cm (0.960 x 1.087 in) SMT: 2.199 x 3.4 x 0.305 cm (0.866 x 1.33 x 0.120 in) Micro: 13 x 19 x 2 mm (0.533 x 0.76 x 0.087 in) |
|
| PROGRAMMANILITY | ||
| Memory | 1 MB / 128 KB RAM (32 KB are available for MicroPython) | |
| NETWORKING AND SECURITY | ||
| Protocol | Zigbee 3.0 | |
| Encryption | 128/256 bit AES | |
| Reliable packet delivery | Retries/acknowledgements | |
| IDS | PAN ID and addresses, cluster IDs and endpoints (optional) | |
| Channels | 16 channels | |
| POWER REQUIREMENTS | ||
| Supply voltage | 2.1 to 3.6 V | |
| Transmit current | 40 mA at 8 dBm | 140 mA at 19 dBm |
| Receive current | 17 mA | |
| Power-down current | 2 micro Amp at 25 ºC (77 ºF) | |
| REGULATORY APPROVALS[2] | ||
| FCC, IC (North America) | Yes | Yes |
| ETSI (Europe) | Yes | No |
| RCM (Australia) | Yes | Yes |
| Anatel (Brazil) | Yes | Yes |
| Teleck MIC (Japan) | Yes | No |
| KCC (South Korea) | Yes | No |
Order information
| Order information | Digi XBee® 3 Global LTE Cat 4 |
|---|---|
| DEVOLPMENT KIT | |
| XK3-C-G4-UT-W | Digi XBee 3 Global LTE Cat 4 Development Kit with Digi XBee 3 Global Cat 4 module, antennas (2 cellular U.FL and 1 GNSS U.FL) and development board (XBIB-CU-TH) |
| MODULES | |
| XB3-C-G4-UT-001 | Digi XBee 3 Global LTE Cat 4, 3G / 2G, GNSS, no SIM |
| XB3-C-G4-UT-101 | Digi XBee 3 Global LTE Cat 4, 3G / 2G, GNSS, AT&T SIM |
| XB3-C-G4-UT-102 | Digi XBee 3 Global LTE Cat 4, 3G / 2G, GNSS, Verizon SIM |
| DEVELOPMENT BOARDS | |
| XBIB-CU-TH | Development board – XBee 3, USB-C, through-hole sockets |
| DIGI XBEE® MULTI PROGRAMMER | |
| XBEE-MP-TH | Digi XBee Multi Programmer, through-hole (TH) |
| XBEE-MP-TH-PCB | Digi XBee Multi Programmer, through-hole (TH) printed circuit board |
