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Digi ConnectCore® 8M Mini development kit

Embedded System-on-Module development kit based on i.MX 8M Mini Quad-Core // Digi Part No.: CC-WMX8MM-KIT

Digi ConnectCore 8M Mini - Development Kit inklusive Board // Digi Part No.: CC-WMX8MM-KIT
Digi ConnectCore 8M Nano
Digi ConnectCore 8M Nano

FEATURES

  • System-on-Module platform development kit
  • i.MX 8M Mini quad-core application processor
  • Seamless cellular modem and Digi XBee® integration
  • Low profile Digi SMTplus® form factor
  • Display and camera capacities
  • Digi Part No.: CC-WMX8MM-KIT
SKU: 26457

Description

Digi ConnectCore® 8M Mini development kit: The comprehensive platform for the development of networked devices

With the Digi ConnectCore® 8M Mini development kit, you can design and create powerful, connected products on an industrial-grade platform. The kit provides a complete development environment with the following components:

  • Digi ConnectCore® 8M Mini development board
  • Console connection cable
  • Dual-band antenna
  • Power supply and accessories
  • Reference designs for LVDS, HDMI and CAN-FD

Features and benefits:

  • Powerful i.MX 8M Mini Quad-Core System-on-Module (SoM): Developed for demanding industrial applications, it provides the ideal basis for versatile IoT projects.
  • Comprehensive software support: Digi Embedded Yocto (Linux) with full Yocto project support and Digi Embedded Android for a flexible and robust development platform.
  • Video capabilities and security: Integrated Video Processing Unit (VPU) for high-resolution multimedia capabilities and Digi TrustFence® for a strong security foundation that protects IoT devices from threats.
  • Advanced power management and system reliability: Digi Microcontroller Assist™ supports efficient power management and ensures maximum operational reliability
    Pre-certified dual-band connectivity: Support for 802.11a/b/g/n/ac and Bluetooth® 5 for flexible wireless connectivity.
  • Seamless cloud and edge computing integration: Optimum adaptation to the requirements of modern IoT and edge computing applications

Versatile interfaces:

The development board offers on-board interfaces for HDMI or LVDS displays and enables easy expansion of wireless connectivity to IoT protocols worldwide through Digi XBee® integration.

With the Digi ConnectCore® 8M Mini development kit, developers have everything they need to bring their IoT and embedded projects to market efficiently and securely.

Digi Part No.: CC-WMX8MM-KIT

Specifications

Digi ConnectCore® 8M Mini
SPECIFICATIONS
Application processor NXP® i.MX8 Mini

  • Four Cortex®-A53 cores at 1.6 GHz
  • Cortex-M4 400 MHz core processor for low-power processing
Memory Up to 8 GB eMMC, up to 2 GB of LPDDR4 (32-bit)
PMIC NXP PCA9450
Graphics Graphic Processing Unit:

  • GCNanoUltra for 3D acceleration
  • GC320 for 2D acceleration
  • LCDIF display controller, supporting up to 1080 p 60 fps display through MIPI DSI
  • MIPI DSI (4-lane) with PHY (display interface)
  • MIPI CSI (4-lane) with PHY (camera interface)

Video Processing Unit:

  • 1080 p 60 HEVC H.265 (decode)
  • VP9, H.264, VP8 (encode/decode)
Security Digi TrustFence®, TRNG, TrustZone, Secure RTC, Secure JTAG, Secure Element
Peripherals / Interfaces
  • 1x PCI Express 2.0. (PCIe)
  • 2x USB 2.0 OTG controllers with integrated PHY interfaces
  • 3x Ultra Secure Digital Host Controller (uSDHC) interfaces
  • 5x Universal Asynchronous Receiver / Transmitter (UART) modules
  • 4x I2C modules
  • 3x SPI modules
  • 1x Quad SPI
  • 10x PWM channels
  • 1x 16-bit ADC module with accurate internal voltage reference, up to 20 channels
  • 5x Synchronous Audio Interface (SAI) modules supporting I2S, AC97, TDM, codec/DSP and DSD interfaces
  • 1x S/PDIF input and output, including a raw capture input mode
  • 8-channel Pulse Density Modulation (PDM) input
  • Up to 112 GPIOs
Ethernet 10/100/1000M Ethernet + AVB
Wi-Fi 802.11a/b/g/n/ac dual-band wireless
Bluetooth® Bluetooth® 5
On-Module Microcontroller Digi Microcontroller Assist™

  • Independent Cortex-M0+ microcontroller subsystem
  • Supporting ultra-low power modes at <3 µA
Operating temperature Industrial: -40 °C to 85 °C (-40 °F to 185 °F); depending on use case and enclosure/system design
Storage temperature -50 °C to 125 °C (-58 °F to 257 °F)
Relative humidity 5% to 90% (non-condensing)
Radio approvals US, Canada, EU, Japan, Australia/New Zealand
Emissions / Immunity / Safety FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548; FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1)
Design verification emperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
Mechanical dimensions 118 castellated vias, LGA-474, 1.27 mm pitch,
40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in)
Product warranty 3-year

Documents

Digi ConnectCore 8M Mini Development Kit – Datasheet
Digi ConnectCore 8M Mini – Datasheet
Digi ConnectCore Embedded Feature – Product Comparison (SOMs & SBCs)
Digi ConnectCore 8 family – flyer

Order information

Order information Digi ConnectCore® 8M Nano
DEVELOPMENT KIT
CC-WMX8MN-KIT Digi ConnectCore 8M Nano Development Kit
MODULES
CC-WMX-FS7D-NN Digi ConnectCore 8M Nano, Quad Core, 8 GB eMMC, 1 GB LPDDR4, wireless
CC-WMX-FR6D-NN Digi ConnectCore 8M Nano, SoloLite Core, 8 GB eMMC, 512 MB LPDDR4, wireless
CC-MX-FS7D-ZN Digi ConnectCore 8M Nano, Quad Core, 8 GB eMMC, 1 GB LPDDR4, Ethernet
CC-MX-FR6D-ZN Digi ConnectCore 8M Nano, SoloLite Core, 8 GB eMMC, 512 MB LPDDR4, Ethernet
ACCESSORIES
CC-ACC-LCDH-10 LCD Application Kit, including 10 in WXGA (high resolution) LCD panel

Resources

Video: Using the Digi ConnectCore Smart IOmux Tool to Design with ConnectCore SOMs

Watch video

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