- 3U rugged server with 20” depth for edge-optimized applications
- Dual Intel® Xeon® Ice Lake scalable processors
- Up to 7x PCIe Gen4 slots for GPUs, FPGAs and high-performance accelerators
- Up to 16x hot-swappable SATA/SAS/NVMe drives for maximum storage flexibility
- Rugged aluminum housing with high-performance fans for operation at -10° to 50°C
FEATURES
Description
Gen4 3U-SDS Intel server – Rugged edge server with high computing power for AI and HPC
The Gen4 3U-SDS Intel server is a powerful and rugged server platform specifically designed for edge AI and high-performance computing (HPC) applications. Equipped with two Intel® Scalable processors, it offers exceptional computing power for GPU- or FPGA-accelerated computing. With a compact height of 3U and a depth of 47 cm, the server is ideal for use in space-critical edge environments.
Maximum performance with Intel® processors
The server uses the latest generation of Intel® Scalable processors, which ensure high efficiency and scalability. With support for up to 4 TB of memory, the system is ideal for data-intensive workloads in areas such as machine learning, Industry 4.0 and automation.
Expandable architecture with PCIe Gen4
With six full-height PCIe Gen4 x16 slots, four of which support double-width, and an additional PCIe Gen4 x8 slot, the server offers high expandability for GPUs, FPGAs or other accelerator cards. PCIe Gen4 technology enables maximum bandwidth and fast data processing for demanding applications.
The Gen4 3U-SDS Intel server offers support for 8 or 16 SATA/SAS/NVMe drives, including U.2/U.3 NVMe storage solutions that enable low latency and high data throughput rates. The storage architecture is optimized for high availability and scalability to ensure optimal performance in compute-intensive environments.
Ideal for demanding edge and data center environments
Thanks to the resource-enhanced BIOS for scale-out device enumeration and large memory-mapped I/O processes, the server is ideal for hyper-converged infrastructures, rack-level computing and composable architectures. The robust housing with high-performance cooling system ensures reliable operation even under extreme conditions. With its compact design, powerful hardware and state-of-the-art PCIe Gen4 technology, the Gen4 3U-SDS Intel server is the perfect solution for companies that require powerful, scalable and space-saving servers for AI, edge computing and industrial automation.
Manufacturernr.: OSS-SDS-3U-4I
Specifications
| Product: Gen4 3U-SDS Intel Server | |
|---|---|
| SYSTEM | |
| CPU | Dual Intel® Xeon® Ice Lake Scalable CPUs with up to 270 W TDP and 40 cores, LGA 4189 Socket P with 3 UPI chip-to-chip bus with up to 11.2 GT/s |
| RAM | Up to 4TB DDR4-2933MHz 3DS ECC RDIMM or LRDIMM, 1.2V Low Profile 2933/2666/2400/2133MHz frequencies in 64GB, 128GB and 256GB capacities per module |
| Storage | 8 or 16 hot-swap configurable SATA-3, SAS-3 or NVMe x4 2.5” x 15mm drive carriers – 12Gb SAS-3 or 6Gb SATA-3 SFF-8680 slots -or- – NVMe x4 32Gb slots Up to 8 SATA-3 slots use no PCIe slots 8x and 16x SAS-3 slots require 1 and 2 PCIe x16 HHHL slots respectively 8x and 16x NVMe x2 slots require 1 and 2 x16 PCIe HHHL slots respectively Further expansion up to 4PB possible using OSS JBOF expansion systems such as SB2000 2x M.2 x4 or 4x NVMe internal drive connections possible with jumper option |
| Expansion | 4x PCIe Gen4 x16 full-height, 10.5” length, double-width slots (suitable for GPUs) 2x PCIe Gen4 x16 full-height, half-length, single-width slots 1x PCIe Gen4 x8 full-height, half-length, single-width slot with x8 physical connection |
| BIOS | 128 Mb SPI flash EEPROM with AMI BIOS Supports PnP, PCI 3.0, ACPI 1.0-4.0, USB keyboard support, UEFI 2.3.1, 1TB BAR1 max size and 256 PCI bus enumeration support |
| INTERFACE | |
| Ethernet | 2x Intel® X550 10Gigabit Ethernet with one RJ-45 10GBASE-T LAN connection each Additional 25, 40 and 100 Gb Ethernet, 100 Gb Infiniband or 32 Gb Fiber Channel interfaces available 1 x RJ-45 dedicated IPMI LAN port from RTL8211E |
| COM | 2x COM (1x rear and 1x internal header) |
| USB | 6x USB 3.0 (4x on the rear, 1x header and 1x type A internal) 2x USB 2.0 (1x internal header) |
| Video | 1x VGA connector |
| Audio | 7.1HD Audio header |
| Other | 2x Disk-on-Module ports 1x Trusted Platform Management TPM 1.2 20-pin header |
| ENVIRONMENTAL | |
| Chassis | Rugged and lightweight aluminum frame Black anodized outer casing |
| Cooling | 6x 40x56mm + 1x 80x38mm high-performance fans are mounted behind the front panel and cool add-in cards up to 300W |
| Power Supply | Dual N+1 2600-watt AC 110-240V CPRS power supplies Dual N+1 48V DC Input power supplies |
| Operating Temperature | -10° ~ 50°C[1] at 0 ~ 3,000m altitude |
| Storage Temperature | -40° ~ 85°C |
| Humidity | Operating: 5~ 90% non-condensing, maximum dew point 21°C, maximum rate of change 5°C/hour Non-operating: 5~ 90% non-condensing, maximum dew point 27°C, maximum rate of change 5°C/hour |
| Dimensions (W x H x D) | 482.6 x 177.8 x 469.9mm |
| Weight | 20.4kg |
| Certifications | ROHS3, WEEE
Tested to conform to the following standards: Designed to conform to the following extended standards: |
[1] These temperature ranges may require GPU/CPU throttling.
