- System-on-Module platform
- NXP i.MX 8X QuadXPlus 1.2GHz
- Multi-display and camera functions
- Seamless Digi XBee® 3 integration
- Digi Part No.: CC-MX-JM8D-ZN
Description
Digi ConnectCore® 8X QuadXPlus SoM: Powerful Quad-Core System-on-Module
The Digi ConnectCore® 8X QuadXPlus SoM is a powerful System-on-Module (SOM) with a QuadXPlus 1.2 GHz processor that offers outstanding computing power and high reliability.
Technical specifications
- Processor: QuadXPlus 1.2 GHz
- Memory: 8 GB eMMC, 2 GB LPDDR4
- Operating temperature: -40 ºC to 85 ºC (-40 ºF to 185 ºF)
With a robust quad-core processor, generous memory and a wide operating temperature range, the Digi ConnectCore® 8X QuadXPlus SoM is the ideal solution for demanding industrial applications.
Whether in automation, medical technology or other areas, this reliable SoM offers the necessary performance to develop innovative products and use them in a variety of environments.
Digi Part No: CC-MX-JM8D-ZN
Specifications
| Digi ConnectCore® 8X | Digi ConnectCore® 8X Dual | |
|---|---|---|
| SPECIFICATIONS | ||
| Application processor |
NXP® i.MX8QuadXPlus 4x Cortex® — A35 cores at 1.2 GHz |
NXP® i.MX8DualXZ 2x Cortex® — A35 cores at 1.2 GHz |
| Memory | Up to 64 GB eMMC, up to 4 GB of LPDDR4 | |
| PMIC | NXP PF8100 | |
| Graphics | Multi-stream-capable HD video engine with H.265 (4Kp30), H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders | H.264 (1080p60), VP6/VP8 (1080p60), MPEG-2 (1080p60), MPEG4 (1080p), RealVideo (1080p) decode and H.264 (1080p30) encode; 3D video playback in HD in high-performance families; Superior 3D graphics performance with up to four shaders |
| Security | Digi TrustFence®, TRNG, TrustZone, Ciphers, Security Cntrl, Secure RTC, Secure JTAG, eFuses (OTP) | |
| Peripherals / Interfaces[2] | 1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC), 5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4); 8x I2C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support), 4x SPI, 1x ESAI, 4x SAI/I2S/SSI/AC97, S/PDIF Tx/Rx, 3x FlexCAN, MLB150 + DTCP, USB 3.0 OTG with PHY, USB 2.0 OTG with PHY, 4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)[1], 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI, 24-bit RGB, RTC, Watchdog, Timers, JTAG |
1x SD 3.0 card interface handles SD/SDIO/MMC protocols (1x additional one reserved on the SOM for supporting eMMC), 5x UARTs (4x UARTs from Cortex-A35 core, 1x UART from Cortex-M4); 8x I2C (4xI2C high-speed DMA support 4x I2C low-speed no DMA support), 4x SPI, 1x ESAI, 4x SAI/I2S/SSI/AC97, S/PDIF Tx/Rx, 3x FlexCAN, MLB150 + DTCP, USB 2.0 OTG with PHY, 4x PWM, GPIO, Keypad, PCIe 3.0 (x1 lane)[1], 2x MIPI DSI/LVDS, MIPI CSI, 8/10-bit CSI, 24-bit RGB, RTC, Watchdog, Timers, JTAG |
| Ethernet | 2x 10/100/1000M Ethernet + AVB | |
| Wi-Fi | 802.11a/b/g/n/ac: 2.412 – 2.484 GHz, 4.900 – 5.850 GHz 802.11b: 1, 2, 5.5, 11 Mbps (17 dBm typical ±2 dBm) 802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps (15 dBm typical ±2 dBm) 802.11n: 15, 30, 45, 60, 90, 120, 135, 150 Mbps (12 dBm typical ±2 dBm) HT40, MCS 0-7 802.11ac: 15, 30, 45, 60, 90, 120, 135, 150, 180, 200 Mbps (10 dBm typical ±2 dBm) HT40, MCS 0-9 Note: all data rates provided above are for 1 spatial stream. For 2x spatial steams, double the data rate. Security: WEP, WPA-PSK/WPA2-personal, WPA/WPA2-enterprise, 802.11i, Access Point Mode (up to 10 clients), Wi-Fi Direct Industry certifications: Wi-Fi Alliance Logo Certification Ready, CCXv4 ASD Ready |
|
| Bluetooth® | Bluetooth® 5 | |
| On-module microcontroller assist |
Digi Microcontroller Assist™ Independent Cortex-M0+ microcontroller subsystem |
|
| Operating temperature | Industrial: −40 °C to 85 °C (−40 °F to 185 °F) (depending on use case and enclosure/system design) | |
| Storage temperature | −50 °C to 125 °C (−58 °F to 257 °F) | |
| Relative humidity | 5% to 90% (non-condensing) | |
| Funkzulassungen | US, Canada, EU, Japan, Australia/New Zealand | |
| Emissions / Immunity / Safety | FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1) |
|
| Design verification | Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78 Vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT |
|
| Mechanical dimensions | 118 castellated vias, LGA-474, 1.27 mm pitch, fully shielded for radio emissions and thermal management (heat-spreading) 40 mm x 45 mm x 5.4 mm (1.6 in x 1.8 in x 0.21 in) | |
| Product warranty | 3-year | |
[1] PCIe is only supported on wired variants
[2] Each single PHY can either be a 1 x 4 lane MIPI-DSI or a 1 x 1 channel LVDS interface for a total of 2 display interfaces. In combination, the two PHYs can be configured to be a single 2-channel LVDS interface.
Documents
| Digi ConnectCore 8X SBC Pro- Datasheet | |
| Digi ConnectCore 8X – Datasheet | |
| Digi ConnectCore 8X SBC Pro Development Kit -Datasheet |
Order information
| Order information | Digi ConnectCore® 8X series |
|---|---|
| DEVELOPMENT KIT | |
| CC-WMX8-KIT | Digi ConnectCore 8X SBC Pro Development Kit |
| SBCs | |
| CC-SBP-WMX-JM8E | Digi ConnectCore® 8X SBC Pro |
| MODULES | |
| CC-MX-JQ7D-ZN | Digi ConnectCore® 8X SOM DualXZ 1.2 GHz, 8 GB eMMC, 1 GB LPDDR4 |
| CC-MX-JM7D-ZN | Digi ConnectCore® 8X SOM QuadXPlus 1.2 GHz, 8 GB eMMC, 1 GB LPDDR4 |
| CC-MX-JM8D-ZN | Digi ConnectCore® 8X SOM QuadXPlus 1.2 GHz, 8 GB eMMC, 2 GB LPDDR4 |
| CC-WMX-JM7D-NN | Digi ConnectCore® 8X SOM QuadXPlus 1.2 GHz, 8 GB eMMC, 1 GB LPDDR4, 802.11a/b/g/n/ac 2×2, Bluetooth® 5 |
| CC-WMX-JM8E-NN | Digi ConnectCore® 8X SOM QuadXPlus 1.2 GHz, 16 GB eMMC, 2 GB LPDDR4, 802.11a/b/g/n/ac, 2×2, Bluetooth® 5 |
| ACCESSORIES | |
| CC-ACC-LCDH-10 | LCD Application Kit, including 10 in WXGA (high resolution) LCD panel |
