- Intel® Xeon® Core™ 9th/8th Gen
- Up to 64 GB DDR4 2666/2400 SDRAM
- 2x SATA 2.5″ HDD/SSD
- Integrated Power-Back-Up Module
- Operating temp.: -40°C ~ 70 °C
- Dimensions: 220 x 310 x 86.5mm (1/2-Rack)
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Product: SEMIL-1300 Serie
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Product: SEMIL-1300 Serie
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Description
SEMIL-1300 Series – Strong computing power and robust design
The SEMIL-1300 series is a rugged, fanless computer with rugged M12 I/O connectors in a standard 2U 19″ half rack form factor chassis. Powered by an Intel® Xeon® E or 9th/ 8th-Gen Core™ CPU and coupled with a workstation-quality Intel® C246 chipset, it supports up to 64 GB DDR4 ECC/non-ECC memory and offers flexible mounting options for wall or rack mounting.
The SEMIL-1300 series includes a passive thermal design for fanless operation from -40 °C to 70 °C. It offers a variety of I/O connections with M12 connectors that are reliably robust, cost effective and available off-the-shelf. There are also generic I/Os with screw-lock mechanisms that guarantee an extremely robust connection in shock and vibration environments. It has four 802.3at PoE+ ports, each delivering 25W of power to the connected device, such as an IP or GigE camera. Designed for 4G/5G and WiFi5/WiFi6 wireless connectivity, SEMIL-1300 supports an 8-48V wide-range DC input with ignition power control for in-vehicle use, in compliance with EN 50155.
In addition, the SEMIL-1311J is equipped with a patented SuperCAP-based UPS of 2500 watt seconds of stored energy to maintain the system and safely shut down in the event of an unforeseen power failure. It is the perfect solution for data protection and applications in environments with unstable power supply. With a standard half-rack design, proven wide temperature operation, shock/vibration and power interruption protection, the SEMIL-1300 series is the ideal rugged solution for extremely rugged applications.
Specifications
SEMIL-1300 Series | |
---|---|
Processor | Supports Intel® Xeon® E and 9th/ 8th-Gen Core™ CPU (LGA1151 socket) – Xeon E 2278GE (8C/16T) / 2278GEL (8C/16T) / 2176G (6C/12T) – i7-9700E, i7-9700TE, i7-8700, i7-8700T – i5-9500E, i5-9500TE, i5-8500, i5-8500T – i3-9100E, i3-9100TE, i3-8100, i3-8100T |
Chipset | Intel® Q370 |
RAM | Up to 64GB DDR4 2666/ 2400 SDRAM (two SODIMM slots) |
Memory | 2x Internal SATA port for 2.5″ HDD/ SSD installation, supporting RAID 0/ 1 1x M.2 2280 M key socket (PCIe Gen3 x4) for NVMe SSD or Intel® Optane™ memory installation 2x full-size mSATA port (mux with mini-PCIe) |
Interface | 1x IEEE 802.3at (25.5W) Gigabit PoE+ Ports by Intel® I219 (M12 X-coded) 3x IEEE 802.3at (25.5W) Gigabit PoE+ Ports by Intel® I210 (M12 X-coded) 1x 10 GbE Port by Intel® X550AT Controller (M12 X-coded)** (Optional) 1x VGA (M12 A-coded), 1920 x 1200 Resolution 1x DisplayPort Connector, 4096 x 2304 Resolution 2x 3-wires RS-232 Ports COM1 & COM2 (M12 A-coded) 1x programmable RS-232/ 422/ 485 Port (COM3, DB9) 1x RS-232 Port (COM4, DB9) 4x USB 3.1 Gen1 2x USB 2.0 (M12) 1x USB 2.0 (intern) 1x 3.5 mm for mic-in and speaker-out |
Expansion | 2x Full-Size mini PCI Express socket (mux with mSATA) 1x M.2 3042/ 3052 B Key socket for M.2 4G/ 5G module 1x M.2 2242/ 2252 E Key for WiFi module |
Environment | Operating temp. with 35W CPU: -40°C ~ 70°C *** Operating temp. with >=65W CPU: -40°C ~ 70°C */** (35W TDP) -40°C ~ 60°C */** (65W TDP) Storage temp.: -40° ~ 85°C Hummidity: 10%~90% , non-condensing Vibration: Operating, MIL-STD-810G, Method 514.7, Category 4 Shock: Operating, MIL-STD-810G, Method 516.7, Procedure I |
Mechanics | Dimensions (W x D x H): 220 x 310 x 86.5mm Weight: 5.8kg |
Mounting | Wall-Mount Rack-Mount |
Certificates | EN-50155, CE/FCC Class A, according to EN 55032 & EN 55035 |
** For optional 10GbE support, please contact Neousys Technology *** For Xeon E 2176G/ 2278GE, i7-9700E, and i7-8700 running at 65W mode, the highest operating temperature shall be limited to 50°C and thermal throttling may occur when sustained full-loading applied. Users can configure CPU power in BIOS to obtain higher operating temperature. **** For sub-zero operating temperature, a wide temperature HDD or Solid State Disk (SSD) is required. |
Ordering information
SEMIL-1301 | SEMIL-1311J | |
---|---|---|
CPU | Intel® Xeon® E and 9th/ 8th-Gen Core™ CPU | |
Features | M12 Interface | M12 Interface Supercondensator Power-Back-Up Module |
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