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Digi ConnectCore® 93 Single-Core

Embedded system-on-module based on NXP i.MX 93 // Digi Part No.: CC-MX-ZC6D-Z1

FEATURES

  • Scalable and wireless system-on-modules
  • NXP i.MX 93 single-core application processor
  • Low-profile Digi SMTplus™
  • 2x Gigabit Ethernet
  • Integration of mobile radio modem and Digi XBee®
  • Digi Part No.: CC-MX-ZC6D-Z1
SKU: 27737

Description

Digi ConnectCore® 93 Single-Core & Ethernet – Embedded System-on-Module based on the NXP i.MX 93 processor with AI/ML NPU

The Digi ConnectCore® 93 System-On-Module (SOM) defines a new dimension in wireless connectivity and performance. Based on the NXP i.MX 93 processor, this single-core SOM offers a reliable and efficient solution for embedded systems.

At the heart of the module is the NXP i.MX 93 processor, which guarantees reliable computing power. With 8 GB flash memory (eMMC) and 512 MB LPDDR4/LPDDR4X RAM, the SOM offers sufficient capacity for demanding applications.

Versatile connectivity in a compact design

With two Gigabit Ethernet ports, the Digi ConnectCore® 93 SOM enables fast and reliable wired connectivity. The Digi ConnectCore® 93 SOM is designed to integrate seamlessly into a wide range of applications. Its compact design and reliability make it the ideal choice for embedded systems that require wireless connectivity.

Integrated security

Thanks to the integrated Digi TrustFence® technology, the module offers advanced security features that ensure the protection of connected devices and simplify the development process. Whether in industrial, medical, energy or transportation applications, the Digi ConnectCore® 93 SOM is designed to meet diverse application requirements and provide a robust, long-term solution for embedded systems.

Digi Part No.: CC-MX-ZC6D-Z1

Specifications

Digi ConnectCore® 93
FEATURES
Application processor NXP® i.MX 93

  • Up to 2x Cortex®-A55 cores at 1.7 GHz
  • 1x Cortex-M33 core at 250 MHz core for real-time processing
Memory Up to 32 GB flash (eMMC), up to 2 GB LPDDR4 / LPDDR4X (16-bit)
NPU AI/ML Arm® Ethos U65 micro neural processor
PMIC NXP PCA9451
Graphics / Display 2D Engine:

  • Blended/composition
  • Resize
  • Color space conversion

1x 1080p 60 MIPI DSI (4-lane, 1.5 Gbps/lane) with PHY
1x 720p 60 LVDS (4-lane)

Camera 1x 1080p 60 MIPI-CSI (2-lane, 1.5 Gbps/lane) with PHY
8-bit parallel YUV/RGB
Security Digi TrustFence®: secure boot, filesystem encryption, tamper detection, secure JTAG, secure console, secure build environments, secure firmware updates; EdgeLock secure enclave: crypto, tamper detection, secure clock, secure boot, eFuse key storage, random number; Arm TrustZone (Cortex-A and Cortex-M)
Peripherals / Interfaces 2x USB 2.0 OTG controllers with integrated PHY interfaces
1x Ultra Secure Digital Host Controller (uSDHC) interfaces
8x Low Power Universal Asynchronous Receiver / Transmitter (LPUART) modules
8x Low Power I2C modules, 2x I3C
8x Low Power SPI (LPSPI) modules
2x FlexCAN with flexible data-rate (FD) support
4x pulse-width modulator (PWM) with 16-bit counter
1x 12-bit ADC module with accurate internal voltage reference, up to 4 channels
3x Synchronous Audio Interface (SAI) modules (up to 4 lanes) supporting I2S, AC97, TDM, codec/DSP and DSD interfaces
1x S/PDIF input and output, including a raw capture input mode
8-channel Pulse Density Modulation (PDM) input
Up to 112 GPIOs
Ethernet 2x 10/100/1000M Ethernet with EEE, AVB and IEEE 1588 (1x TSN)
Wi-Fi Wi-Fi 6 802.11ax dual-band 1×1 wireless
Bluetooth® Bluetooth® 5.3
802.15.4 802.15.4 (optional)
On-module microcontroller assist Digi Microcontroller Assist™ for advanced power management, security, peripheral support and system reliability (optional)

  • Independent Cortex-M0+ microcontroller subsystem
  • Supporting ultra-low power modes at <2.5 µA
Operating temperature Industrial: −40 °C to 85 °C (−40 °F to 185 °F); depending on use case and enclosure/system design
Storage temperature −50 °C to 125 °C (−58 °F to 257 °F)
Relative humidity 5% to 90% (non-condensing)
Radio approvals[1] US, Canada, EU, Japan, Australia/New Zealand, Brazil, Mexico
Emissions / Immunity / Safety [1] FCC Part 15 Class B, EN 55022 Class B, EN 61000-3-2, EN 61000-3-3, ICES- 003 Class B, VCCI Class II, AS 3548, FCC Part 15 Subpart C Section 15.247, IC (Industry Canada), RSS-210 Issue 5 Section 6.2.2(o), EN 300 328, EN 301 489-17, EN 55024, EN 301 489-3, Safety (IEC 62368-1)
Design verification [1] Temperature: IEC 60068-2-1, IEC 60068-2-2, IEC 60068-2-78
Vibration/shock: IEC 60068-2-6, IEC 60068-2-64, IEC 60068-2-27, HALT
Mechanical dimensions 118 castellated vias, LGA-474, 1.27 mm pitch, 40 mm x 45 mm x 3.5 mm (1.6 in x 1.8 in x 0.1 in)
Product warranty 3-year

[1] Visit product certifications for latest updates.

Documents

Digi ConnectCore 93 – Datasheet

Order information

Order information Digi ConnectCore® 93 series
DEVELOPMENT KIT
CC-WMX93-KIT Digi ConnectCore 93 Development Kit

  • Digi ConnectCore 93 development board with i.MX 93 dual-core, NPU, 8 GB eMMC, 1 GB LPDDR4 wireless SOM
MODULES
CC-WMX-YC7D-KN Digi ConnectCore 93 System-On-Module — dual-core, NPU, wireless

  • NXP i.MX 93
  • 8 GB flash (eMMC)
  • 1 GB LPDDR4 / LPDDR4X
  • AI/ML Arm Ethos U65 micro neural processor
  • 2x Gigabit Ethernet
  • Wi-Fi 6 802.11ax
  • Bluetooth 5.3
CC-MX-YC7D-ZN Digi ConnectCore 93 System-On-Module — dual-core, NPU, Ethernet

  • NXP i.MX 93
  • 8 GB flash (eMMC)
  • 1 GB LPDDR4 / LPDDR4X
  • AI/ML Arm Ethos U65 micro neural processor
  • 2x Gigabit Ethernet
CC-WMX-ZC6D-L1 Digi ConnectCore 93 System-On-Module — single-core, wireless

  • NXP i.MX 93
  • 8 GB flash (eMMC)
  • 512 MB LPDDR4 / LPDDR4X
  • 2x Gigabit Ethernet
  • Wi-Fi 6 802.11ax
  • Bluetooth 5.3
CC-MX-ZC6D-Z1 Digi ConnectCore 93 System-On-Module — single-core, Ethernet

  • NXP i.MX 93
  • 8 GB flash (eMMC)
  • 512 MB LPDDR4 / LPDDR4X
  • 2x Gigabit Ethernet
ACCESSORIES
CC-ACC-LCDH-10 LCD Application Kit, including 10 in WXGA (high resolution) LCD panel

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